Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424527 | Electronic package with tapered pedestal | Kamal K. Sikka, Hilton T. Toy, Thomas Weiss | 2019-09-24 |
| 10381276 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-08-13 |
| 10373925 | Metal pad modification | Ekta Misra | 2019-08-06 |
| 10325830 | Multipart lid for a semiconductor package with multiple components | Charles L. Arvin, Steven P. Ostrander | 2019-06-18 |
| 10276534 | Reduction of solder interconnect stress | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2019-04-30 |
| 10276535 | Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2019-04-30 |
| 10249548 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-04-02 |
| 10108753 | Laminate substrate thermal warpage prediction for designing a laminate substrate | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2018-10-23 |
| 10096557 | Tiled-stress-alleviating pad structure | Ekta Misra, Mukta G. Farooq | 2018-10-09 |
| 10090271 | Metal pad modification | Ekta Misra | 2018-10-02 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9865557 | Reduction of solder interconnect stress | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2018-01-09 |
| 9842810 | Tiled-stress-alleviating pad structure | Ekta Misra, Mukta G. Farooq | 2017-12-12 |
| 9837333 | Electronic package cover having underside rib | Kamal K. Sikka | 2017-12-05 |
| 9754905 | Final passivation for wafer level warpage and ULK stress reduction | Ekta Misra | 2017-09-05 |
| 9563732 | In-plane copper imbalance for warpage prediction | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2017-02-07 |
| 9105500 | Non-hermetic sealed multi-chip module package | Paul F. Bodenweber, Hilton T. Toy, Jeffrey A. Zitz | 2015-08-11 |
| 8860206 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2014-10-14 |
| 8592970 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2013-11-26 |