Issued Patents All Time
Showing 51–75 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773751 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2017-09-26 |
| 9761516 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2017-09-12 |
| 9721919 | Solder bumps formed on wafers using preformed solder balls with different compositions and sizes | — | 2017-08-01 |
| 9721864 | Low cost hermetic micro-electronics | Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre | 2017-08-01 |
| 9704822 | Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates | John U. Knickerbocker | 2017-07-11 |
| 9660116 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2017-05-23 |
| 9633925 | Visualization of alignment marks on a chip covered by a pre-applied underfill | Katsuyuki Sakuma, Mukta G. Farooq | 2017-04-25 |
| 9606308 | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow | Tymon Barwicz, Yves Martin | 2017-03-28 |
| 9606142 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9579738 | Flux composition and techniques for use thereof | Kang-Wook Lee, Nathalie Normand, Valerie Oberson | 2017-02-28 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Bing Dang, Eric P. Lewandowski, Bucknell C. Webb | 2016-11-29 |
| 9466590 | Optimized solder pads for microelectronic components | Tymon Barwicz, Yves Martin | 2016-10-11 |
| 9418976 | Chip stack with electrically insulating walls | Evan G. Colgan | 2016-08-16 |
| 9393633 | Method of joining a chip on a substrate | Pascal Blais, Paul F. Fortier, Kang-Wook Lee, Soojae Park, Robert L. Toutant +1 more | 2016-07-19 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Da-Yuan Shih | 2016-05-17 |
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Eric D. Perfecto, Nicholas A. Polomoff | 2016-05-17 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Michael A. Gaynes, Eric P. Lewandowski, Robert J. Polastre | 2016-04-26 |
| 9318641 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2016-04-19 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Da-Yuan Shih | 2016-04-05 |
| 9305866 | Intermetallic compound filled vias | Minhua Lu | 2016-04-05 |
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Paul A. Lauro | 2016-03-22 |
| 9275879 | Multi-chip module with rework capability | Michael A. Gaynes, Jeffrey D. Gelorme | 2016-03-01 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Paul A. Lauro | 2016-03-01 |
| 9263378 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2016-02-16 |
| 9252120 | Copper post solder bumps on substrates | Da-Yuan Shih | 2016-02-02 |