Issued Patents All Time
Showing 76–100 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9231133 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2016-01-05 |
| 9095081 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Paul A. Lauro | 2015-07-28 |
| 9093446 | Chip stack with electrically insulating walls | Evan G. Colgan | 2015-07-28 |
| 9082754 | Metal cored solder decal structure and process | Peter A. Gruber | 2015-07-14 |
| 9012266 | Copper post solder bumps on substrates | Da-Yuan Shih | 2015-04-21 |
| 8993379 | Chip stack with electrically insulating walls | Evan G. Colgan | 2015-03-31 |
| 8987132 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Paul A. Lauro | 2015-03-24 |
| 8978960 | Flip chip assembly apparatus employing a warpage-suppressor assembly | Peter J. Brofman, Katsuyuki Sakuma | 2015-03-17 |
| 8963340 | No flow underfill or wafer level underfill and solder columns | Claudius Feger, Michael A. Gaynes, Da-Yuan Shih | 2015-02-24 |
| 8944306 | Forming metal preforms and metal balls | Peter A. Gruber, Paul A. Lauro | 2015-02-03 |
| 8945995 | Copper post solder bumps on substrates | Da-Yuan Shih | 2015-02-03 |
| 8921221 | IMS (injection molded solder) with two resist layers forming solder bumps on substrates | Mark H. McLeod | 2014-12-30 |
| 8912045 | Three dimensional flip chip system and method | Bing Dang | 2014-12-16 |
| 8889456 | Method of fabricating uniformly distributed self-assembled solder dot formation for high efficiency solar cells | Augustin J. Hong, Jeehwan Kim, Devendra K. Sadana | 2014-11-18 |
| 8877556 | Copper post solder bumps on substrates | Da-Yuan Shih | 2014-11-04 |
| 8875978 | Forming constant diameter spherical metal balls | Claudius Feger, Peter A. Gruber, Mark H. McLeod | 2014-11-04 |
| 8870051 | Flip chip assembly apparatus employing a warpage-suppressor assembly | Peter J. Brofman, Katsuyuki Sakuma | 2014-10-28 |
| 8841544 | Uniformly distributed self-assembled solder dot formation for high efficiency solar cells | Augustin J. Hong, Jeehwan Kim, Devendra K. Sadana | 2014-09-23 |
| 8833636 | Forming an array of metal balls or shapes on a substrate | Peter A. Gruber, Paul A. Lauro | 2014-09-16 |
| 8828860 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Paul A. Lauro | 2014-09-09 |
| 8820612 | Injection molded solder process for forming solder bumps on substrates | Claudius Feger, Mark H. McLeod, Eric D. Perfecto | 2014-09-02 |
| 8759961 | Underfill material dispensing for stacked semiconductor chips | Katsuyuki Sakuma, Bucknell C. Webb | 2014-06-24 |
| 8759963 | Underfill material dispensing for stacked semiconductor chips | Katsuyuki Sakuma, Bucknell C. Webb | 2014-06-24 |
| 8685858 | Formation of metal nanospheres and microspheres | Augustin J. Hong, Woo-Shik Jung, Jeehwan Kim, Devendra K. Sadana | 2014-04-01 |
| 8669137 | Copper post solder bumps on substrate | Da-Yuan Shih | 2014-03-11 |