Issued Patents All Time
Showing 126–137 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008122 | Pressurized underfill cure | Michael A. Gaynes, Satoru Katsurayama | 2011-08-30 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2011-07-19 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Kazushige Toriyama | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2011-04-19 |
| 7906420 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Paul A. Lauro | 2011-03-15 |
| 7891538 | Techniques for arranging solder balls and forming bumps | Russell A. Budd, Frank R. Libsch | 2011-02-22 |
| 7867842 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Paul A. Lauro | 2011-01-11 |
| 7868457 | Thermo-compression bonded electrical interconnect structure and method | Bruce K. Furman | 2011-01-11 |
| 7838954 | Semiconductor structure with solder bumps | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2010-11-23 |
| 7786001 | Electrical interconnect structure and method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Da-Yuan Shih | 2010-08-31 |
| 7780063 | Techniques for arranging solder balls and forming bumps | Russell A. Budd, Frank R. Libsch | 2010-08-24 |
| 6362090 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method | Kyung Wook Paik, Young Doo Jeon, Myung Jin Yim | 2002-03-26 |