Issued Patents All Time
Showing 101–125 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8652941 | Wafer dicing employing edge region underfill removal | Richard F. Indyk, Satoru Katsurayama, Daisuke Oka, Shigefumi Okada | 2014-02-18 |
| 8651359 | Flip chip bonder head for forming a uniform fillet | Michael A. Gaynes | 2014-02-18 |
| 8561880 | Forming metal preforms and metal balls | Peter A. Gruber, Paul A. Lauro | 2013-10-22 |
| 8541299 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Da-Yuan Shih | 2013-09-24 |
| 8541291 | Thermo-compression bonded electrical interconnect structure and method | Bruce K. Furman | 2013-09-24 |
| 8523046 | Forming an array of metal balls or shapes on a substrate | Peter A. Gruber, Paul A. Lauro | 2013-09-03 |
| 8496159 | Injection molded solder process for forming solder bumps on substrates | Claudius Feger, Mark H. McLeod, Eric D. Perfecto | 2013-07-30 |
| 8492262 | Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro | 2013-07-23 |
| 8476773 | Electrical interconnect structure | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Da-Yuan Shih | 2013-07-02 |
| 8408448 | Forming constant diameter spherical metal balls | Claudius Feger, Peter A. Gruber, Mark H. McLeod | 2013-04-02 |
| 8381962 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Kazushige Toriyama | 2013-02-26 |
| 8381966 | Flip chip assembly method employing post-contact differential heating | Rajneesh Kumar, Eric D. Perfecto | 2013-02-26 |
| 8376207 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2013-02-19 |
| 8342387 | Spherical solder reflow method | Peter A. Gruber | 2013-01-01 |
| 8272120 | Apparatus for applying solder to semiconductor chips using decals with aperatures present therein | Peter A. Gruber | 2012-09-25 |
| 8268719 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2012-09-18 |
| 8242010 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Da-Yuan Shih | 2012-08-14 |
| 8162200 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2012-04-24 |
| 8162203 | Spherical solder reflow method | Peter A. Gruber | 2012-04-24 |
| 8164192 | Thermo-compression bonded electrical interconnect structure | Bruce K. Furman | 2012-04-24 |
| 8136714 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2012-03-20 |
| 8138020 | Wafer level integrated interconnect decal and manufacturing method thereof | Peter A. Gruber | 2012-03-20 |
| 8087566 | Techniques for arranging solder balls and forming bumps | Russell A. Budd, Frank R. Libsch | 2012-01-03 |
| 8053283 | Die level integrated interconnect decal manufacturing method and apparatus | Peter A. Gruber | 2011-11-08 |
| 8043893 | Thermo-compression bonded electrical interconnect structure and method | Bruce K. Furman | 2011-10-25 |