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Electronic substrate stacking |
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Functional stiffener that enables land grid array interconnections and power decoupling |
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Multi-layer capacitor package |
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Embedding discrete components having variable dimensions in a substrate |
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2020-06-30 |
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Multi-layer capacitor package |
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2019-01-01 |
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Embedding discrete components having variable dimensions in a substrate |
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2018-05-29 |
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Power decoupling attachment |
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2018-01-16 |
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Redundant clock channel for high reliability connectors |
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Crosstalk reduction in dual inline memory module (DIMM) connectors |
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Crosstalk reduction in dual inline memory module (DIMM) connectors |
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Via and via landing structures for smoothing transitions in multi-layer substrates |
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