Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170252 | Electronic substrate stacking | Daniel J. Friedman, Griselda Bonilla, John U. Knickerbocker | 2024-12-17 |
| 11297717 | Power decoupling attachment | — | 2022-04-05 |
| 11062976 | Functional stiffener that enables land grid array interconnections and power decoupling | Daniel J. Friedman | 2021-07-13 |
| 10892105 | Multi-layer capacitor package | — | 2021-01-12 |
| 10701797 | Embedding discrete components having variable dimensions in a substrate | — | 2020-06-30 |
| 10190031 | Thermally conductive interface composition and use thereof | Jiali Wu, Kellsie Shan | 2019-01-29 |
| 10170249 | Multi-layer capacitor package | — | 2019-01-01 |
| 9986633 | Embedding discrete components having variable dimensions in a substrate | — | 2018-05-29 |
| 9872392 | Power decoupling attachment | — | 2018-01-16 |
| 8257092 | Redundant clock channel for high reliability connectors | Sungjun Chun, Daniel M. Dreps, Dierk Kaller, Rohan U. Mandrekar | 2012-09-04 |
| 7537487 | Crosstalk reduction in dual inline memory module (DIMM) connectors | Jiali Wu | 2009-05-26 |
| 7407415 | Crosstalk reduction in dual inline memory module (DIMM) connectors | Jiali Wu | 2008-08-05 |
| 6992255 | Via and via landing structures for smoothing transitions in multi-layer substrates | Modest M. Oprysko, Jeannine M. Trewhella | 2006-01-31 |
| 6940165 | Impedance matched electrical interconnect using dielectric compounds | Modest M. Oprysko, Jeannine M. Trewhella | 2005-09-06 |