LS

Lei Shan

IBM: 12 patents #9,222 of 70,183Top 15%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
Overall (All Time): #340,557 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12170252 Electronic substrate stacking Daniel J. Friedman, Griselda Bonilla, John U. Knickerbocker 2024-12-17
11297717 Power decoupling attachment 2022-04-05
11062976 Functional stiffener that enables land grid array interconnections and power decoupling Daniel J. Friedman 2021-07-13
10892105 Multi-layer capacitor package 2021-01-12
10701797 Embedding discrete components having variable dimensions in a substrate 2020-06-30
10190031 Thermally conductive interface composition and use thereof Jiali Wu, Kellsie Shan 2019-01-29
10170249 Multi-layer capacitor package 2019-01-01
9986633 Embedding discrete components having variable dimensions in a substrate 2018-05-29
9872392 Power decoupling attachment 2018-01-16
8257092 Redundant clock channel for high reliability connectors Sungjun Chun, Daniel M. Dreps, Dierk Kaller, Rohan U. Mandrekar 2012-09-04
7537487 Crosstalk reduction in dual inline memory module (DIMM) connectors Jiali Wu 2009-05-26
7407415 Crosstalk reduction in dual inline memory module (DIMM) connectors Jiali Wu 2008-08-05
6992255 Via and via landing structures for smoothing transitions in multi-layer substrates Modest M. Oprysko, Jeannine M. Trewhella 2006-01-31
6940165 Impedance matched electrical interconnect using dielectric compounds Modest M. Oprysko, Jeannine M. Trewhella 2005-09-06