Issued Patents All Time
Showing 51–75 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658182 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung | 2020-05-19 |
| 10651507 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2020-05-12 |
| 10651134 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Jeffrey D. Gelorme, Li-Wen Hung | 2020-05-12 |
| 10651036 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung | 2020-05-12 |
| 10638613 | Method of forming a plurality of electro-optical module assemblies | Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more | 2020-04-28 |
| 10637101 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2020-04-28 |
| 10621885 | Wearable sensor monitoring and data analysis | Shriya Kumar, Kang-Wook Lee, Minhua Lu | 2020-04-14 |
| 10605741 | Accurate colorimetric based test strip reader system | Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan | 2020-03-31 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2020-02-25 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, Jae-Woong Nah | 2020-01-28 |
| 10531797 | Wearable blood pressure monitoring system | Hyung-Min Lee, Kang-Wook Lee | 2020-01-14 |
| 10522406 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, Jeffrey D. Gelorme | 2019-12-31 |
| 10522383 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2019-12-31 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2019-11-26 |
| 10483215 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Jeffrey D. Gelorme, Li-Wen Hung | 2019-11-19 |
| 10448830 | Wearable blood pressure monitoring system | Hyung-Min Lee, Kang-Wook Lee | 2019-10-22 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung | 2019-08-27 |
| 10396220 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, Steven L. Wright, Cornelia Tsang Yang | 2019-08-27 |
| 10393798 | Integrated electro-optical module assembly | Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more | 2019-08-27 |
| 10383572 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2019-08-20 |
| 10380284 | Heterogeneous miniaturization platform | Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff | 2019-08-13 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, Cornelia K. Tsang | 2019-08-13 |
| 10361140 | Wafer stacking for integrated circuit manufacturing | Qianwen Chen, Bing Dang, Joana Sofia Branquinho Teresa Maria | 2019-07-23 |
| 10330701 | Test probe head for full wafer testing | Bing Dang, Yu Luo, Yang Liu, Steven L. Wright | 2019-06-25 |