Issued Patents All Time
Showing 101–125 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941788 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff | 2018-04-10 |
| 9941250 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2018-04-10 |
| 9937124 | Microchip substance delivery devices having low-power electromechanical release mechanisms | S. Jay Chey, Bing Dang, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more | 2018-04-10 |
| 9935009 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, Jeffrey D. Gelorme | 2018-04-03 |
| 9900677 | System for continuous monitoring of body sounds | Li-Wen Hung | 2018-02-20 |
| 9897627 | Test probe substrate | Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2018-02-20 |
| 9893047 | Manufacture of wafer—panel die package assembly technology | Bing Dang | 2018-02-13 |
| 9867932 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2018-01-16 |
| 9861313 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2018-01-09 |
| 9865569 | Planarity-tolerant reworkable interconnect with integrated testing | Bing Dang, Yang Liu, Yu Luo, Steven L. Wright | 2018-01-09 |
| 9851379 | Test probe substrate | Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-11-14 |
| 9798886 | Bio-medical sensing platform | Bing Dang, Joana Sofia Branquinho Teresa Maria, Sufi Zafar | 2017-10-24 |
| 9773751 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2017-09-26 |
| 9761516 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2017-09-12 |
| 9748131 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2017-08-29 |
| 9735077 | Heterogeneous miniaturization platform | Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff | 2017-08-15 |
| 9721864 | Low cost hermetic micro-electronics | Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-08-01 |
| 9704822 | Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates | Jae-Woong Nah | 2017-07-11 |
| 9691747 | Manufacture of wafer—panel die package assembly technology | Bing Dang | 2017-06-27 |
| 9684862 | Microelectronic smart tags | Paul S. Andry, Monty M. Denneau, Robert L. Wisnieff | 2017-06-20 |
| 9660525 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff | 2017-05-23 |
| 9648782 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2017-05-09 |
| 9636783 | Method and apparatus for laser dicing of wafers | Russell A. Budd, Bing Dang | 2017-05-02 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, Cornelia K. Tsang | 2017-05-02 |