Issued Patents All Time
Showing 76–100 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2019-06-18 |
| 10314970 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2019-06-11 |
| 10304802 | Integrated wafer-level processing system | Philip G. Emma, Hillery C. Hunter | 2019-05-28 |
| 10297479 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, Cornelia K. Tsang | 2019-05-21 |
| 10258279 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2019-04-16 |
| 10261067 | Method of forming a field effect based nanopore device | Effendi Leobandung | 2019-04-16 |
| 10258142 | Toothbrush with sensors | Minhua Lu, Sufi Zafar | 2019-04-16 |
| 10250963 | System for continuous monitoring of body sounds | Li-Wen Hung | 2019-04-02 |
| 10243091 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, Steven L. Wright, Cornelia Tsang Yang | 2019-03-26 |
| 10229288 | Enhanced data security platform | Bing Dang, Minhua Lu | 2019-03-12 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, Cornelia K. Tsang | 2019-03-05 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2019-03-05 |
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung | 2019-02-26 |
| 10216008 | Saccade and vergence tracking for distance auto focus adjustment | Emily R. Kinser, Roy R. Yu | 2019-02-26 |
| 10168550 | Saccade and vergence tracking for distance auto focus adjustment | Emily R. Kinser, Roy R. Yu | 2019-01-01 |
| 10130302 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2018-11-20 |
| 10132836 | Method of forming surface protrusions on an article and the article with the protrusions attached | Bing Dang, Yang Liu, Maurice Mason, Lubomyr T. Romankiw | 2018-11-20 |
| 10108068 | Liquid crystal lens with variable focal length | Michael S. Gordon, Minhua Lu, Robert J. Polastre | 2018-10-23 |
| 10101631 | Liquid crystal lens with variable focal length | Michael S. Gordon, Minhua Lu, Robert J. Polastre | 2018-10-16 |
| 10098611 | Wearable and non-wearable electronic stethoscopes and use of the digitized acoustic data for data analytics and healthcare | Kang-Wook Lee | 2018-10-16 |
| 10032943 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, Steven L. Wright, Cornelia Tsang Yang | 2018-07-24 |
| 9953501 | Methods of forming microelectronic smart tags | Paul S. Andry, Monty M. Denneau, Robert L. Wisnieff | 2018-04-24 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2018-04-17 |
| 9947567 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2018-04-17 |
| 9945836 | Field effect based nanopore device | Effendi Leobandung | 2018-04-17 |