Issued Patents All Time
Showing 126–150 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9606142 | Test probe substrate | Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9601364 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2017-03-21 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | Bing Dang, Eric P. Lewandowski, Cornelia K. Tsang | 2017-03-07 |
| 9568960 | Supercomputer using wafer scale integration | Evan G. Colgan, Monty M. Denneau | 2017-02-14 |
| 9520779 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff | 2016-12-13 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9391040 | Planarity-tolerant reworkable interconnect with integrated testing | Bing Dang, Yang Liu, Yu Luo, Steven L. Wright | 2016-07-12 |
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2016-04-26 |
| 9313921 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2016-04-12 |
| 9312761 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff | 2016-04-12 |
| 9269561 | Wafer debonding using long-wavelength infrared radiation ablation | Bing Dang, Cornelia K. Tsang | 2016-02-23 |
| 9159602 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, Cornelia K. Tsang | 2015-10-13 |
| 9159616 | Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections | Harvey C. Hamel, Samuel McKnight, Chirag S. Patel | 2015-10-13 |
| 9070586 | Method of forming surface protrusions on an article and the article with the protrusions attached | Bing Dang, Yang Liu, Maurice Mason, Lubomyr T. Romankiw | 2015-06-30 |
| 9029238 | Advanced handler wafer bonding and debonding | Paul S. Andry, Russell A. Budd, Robert E. Trzcinski, Douglas C. La Tulipe, Jr. | 2015-05-12 |
| 8913856 | Manufacturable optical connection assemblies | Lawrence Jacobowitz, Ronald P. Luijten, Subhash L. Shinde | 2014-12-16 |
| 8689437 | Method for forming integrated circuit assembly | Bing Dang, David Danovitch, Mario J. Interrante, Michael J. Shapiro, Van Thanh Truong | 2014-04-08 |
| 8679280 | Laser ablation of adhesive for integrated circuit fabrication | Bing Dang, Matthew J. Farinelli, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang | 2014-03-25 |
| 8629562 | Techniques for modular chip fabrication | Alain Caron | 2014-01-14 |
| 8592932 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, Cornelia K. Tsang | 2013-11-26 |
| 8581392 | Silicon based microchannel cooling and electrical package | John Harold Magerlein | 2013-11-12 |
| 8551816 | Direct edge connection for multi-chip integrated circuits | Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, James L. Speidell | 2013-10-08 |
| 8525168 | Integrated circuit (IC) test probe | Bing Dang, Yang Liu | 2013-09-03 |
| 8421220 | Silicon based microchannel cooling and electrical package | John Harold Magerlein | 2013-04-16 |
| 8419895 | Laser ablation for integrated circuit fabrication | Bing Dang, Aparna Prabhakar, Peter J. Sorce, Robert E. Trzcinski, Cornelia K. Tsang | 2013-04-16 |