Issued Patents All Time
Showing 176–200 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7836353 | Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing | Gerard McVicker, Sri M. Sri-Jayantha | 2010-11-16 |
| 7819376 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, Peter A. Gruber, George R. Proto, Da-Yuan Shih | 2010-10-26 |
| 7820483 | Injection molded soldering process and arrangement for three-dimensional structures | Luc Belanger, David Danovitch | 2010-10-26 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger +5 more | 2010-10-19 |
| 7808798 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2010-10-05 |
| 7799613 | Integrated module for data processing system | Bing Dang, Cornelia K. Tsang | 2010-09-21 |
| 7791168 | Techniques for providing decoupling capacitance | Raymond R. Horton, Edmund J. Sprogis, Cornelia K. Tsang | 2010-09-07 |
| 7784673 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2010-08-31 |
| 7784664 | Fill head for injection molding of solder | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2010-08-31 |
| 7781883 | Electronic package with a thermal interposer and method of manufacturing the same | Sri M. Sri-Jayantha, Gerard McVicker | 2010-08-24 |
| 7768005 | Physically highly secure multi-chip assembly | Vincenzo Condorelli, Claudius Feger, Kevin C. Gotze, Nihad Hadzic, Edmund J. Sprogis | 2010-08-03 |
| 7750459 | Integrated module for data processing system | Bing Dang, Cornelia K. Tsang | 2010-07-06 |
| 7741231 | Techniques for providing decoupling capacitance | Raymond R. Horton, Edmund J. Sprogis, Cornelia K. Tsang | 2010-06-22 |
| 7741153 | Modular chip integration techniques | Alain Caron | 2010-06-22 |
| 7713575 | Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold | Peter A. Gruber | 2010-05-11 |
| 7694869 | Universal mold for injection molding of solder | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2010-04-13 |
| 7691669 | Techniques for providing decoupling capacitance | Raymond R. Horton, Edmund J. Sprogis, Cornelia K. Tsang | 2010-04-06 |
| 7669748 | Conductive bonding material fill techniques | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2010-03-02 |
| 7615477 | Method of fabricating a BGA package having decreased adhesion | Voya R. Markovich, Thomas R. Miller, William J. Rudik | 2009-11-10 |
| 7615405 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Leena Paivikki Buchwalter, Raymond R. Horton, Cornelia K. Tsang, Steven L. Wright | 2009-11-10 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2009-07-28 |
| 7541203 | Conductive adhesive for thinned silicon wafers with through silicon vias | — | 2009-06-02 |
| 7518229 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2009-04-14 |
| 7518225 | Chip system architecture for performance enhancement, power reduction and cost reduction | Philip G. Emma, Chirag S. Patel | 2009-04-14 |
| 7514290 | Chip-to-wafer integration technology for three-dimensional chip stacking | Katsuyuki Sakuma, Paul S. Andry, Kuniaki Sueoka | 2009-04-07 |