Issued Patents All Time
Showing 201–225 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7504718 | Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain | Michael A. Gaynes, Kathleen C. Hinge | 2009-03-17 |
| 7497366 | Global vacuum injection molded solder system and method | S. Jay Chey, Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2009-03-03 |
| 7488624 | Techniques for providing decoupling capacitance | Raymond R. Horton, Edmund J. Sprogis, Cornelia K. Tsang | 2009-02-10 |
| 7486525 | Temporary chip attach carrier | — | 2009-02-03 |
| 7452568 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger +5 more | 2008-11-18 |
| 7442878 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, Mukta G. Farooq, Tasha E. Lopez, Roger A. Quon +1 more | 2008-10-28 |
| 7435627 | Techniques for providing decoupling capacitance | Raymond R. Horton, Edmund J. Sprogis, Cornelia K. Tsang | 2008-10-14 |
| 7416104 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2008-08-26 |
| 7410090 | Conductive bonding material fill techniques | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2008-08-12 |
| 7410092 | Fill head for injection molding of solder | Steven A. Cordes, Peter A. Gruber, James L. Speidell | 2008-08-12 |
| 7402442 | Physically highly secure multi-chip assembly | Vincenzo Condorelli, Claudius Feger, Kevin C. Gotze, Nihad Hadzic, Edmund J. Sprogis | 2008-07-22 |
| 7348270 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, Peter A. Gruber, George R. Proto, Da-Yuan Shih | 2008-03-25 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2008-02-19 |
| 7316572 | Compliant electrical contacts | William E. Bernier, David E. Eichstadt, Mukta G. Farooq | 2008-01-08 |
| 7282391 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Leena Paivikki Buchwalter, Raymond R. Horton, Cornelia K. Tsang, Steven L. Wright | 2007-10-16 |
| 7245022 | Semiconductor module with improved interposer structure and method for forming the same | Mukta G. Farooq, Frank L. Pompeo, Subhash L. Shinde | 2007-07-17 |
| 7170187 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, Mukta G. Farooq, Tasha E. Lopez, Roger A. Quon +1 more | 2007-01-30 |
| 7148566 | Method and structure for an organic package with improved BGA life | Voya R. Markovich, Thomas R. Miller, William J. Rudik | 2006-12-12 |
| 7130522 | Method and structure for two-dimensional optical fiber ferrule | How T. Lin | 2006-10-31 |
| 6984792 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Farooq, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2006-01-10 |
| 6974358 | Discrete magnets in dielectric forming metal/ceramic laminate and process thereof | Govindarajan Natarajan, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 2005-12-13 |
| 6955777 | Method of forming a plate for dispensing chemicals | Govindarajan Natarajan, Umar M. Ahmad, Raschid J. Bezama, James N. Humenik, Rao V. Vallabhaneni | 2005-10-18 |
| 6943108 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Mukta G. Farooq, Srinivasa S. N. Reddy, Robert A. Rita | 2005-09-13 |
| 6829413 | Ferrule-less optical fiber apparatus for optical backplane connector systems | Cameron Brooks, Philip G. Emma, Casimer M. DeCusatis, Lawrence Jacobowitz | 2004-12-07 |
| 6821026 | Redundant configurable VCSEL laser array optical light source | William T. Devine, Jeffrey A. Kash, Steven P. Ostrander, Jeannine M. Trewhella, Ronald P. Luijten | 2004-11-23 |