Issued Patents All Time
Showing 226–250 of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6819813 | Optical land grid array interposer | Stephen Howland, Steven P. Ostrander, Martin Schmatz | 2004-11-16 |
| 6801693 | Optical backplane array connector | Lawrence Jacobowitz, Christoph Berger, Cameron Brooks, Casimer M. DeCusatis, Phillip Emma | 2004-10-05 |
| 6793407 | Manufacturable optical connection assemblies | Lawrence Jacobowitz, Ronald P. Luijten, Subhash L. Shinde | 2004-09-21 |
| 6790515 | Greensheet carriers and processing thereof | Govindarajan Natarajan | 2004-09-14 |
| 6791133 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Mukta G. Farooq, Srinivasa S. N. Reddy, Robert A. Rita | 2004-09-14 |
| 6726984 | Ceramic structure using a support sheet | Govindarajan Natarajan, Robert W. Pasco | 2004-04-27 |
| 6657313 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Faroon, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2003-12-02 |
| 6653776 | Discrete magnets in dielectric forming metal/ceramic laminate and process thereof | Govindarajan Natarajan, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 2003-11-25 |
| 6607780 | Process of forming a ceramic structure using a support sheet | Govindarajan Natarajan, Robert W. Pasco | 2003-08-19 |
| 6607620 | Greensheet carriers and processing thereof | Govindarajan Natarajan | 2003-08-19 |
| 6569278 | Powder metal polymer organic sheet punching for substrate conductors | David H. Gabriels, James N. Humenik, David C. Long | 2003-05-27 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2003-05-06 |
| 6528145 | Polymer and ceramic composite electronic substrates | Daniel G. Berger, Shaji Farooq, Lester W. Herron, James N. Humenik, Robert W. Pasco +2 more | 2003-03-04 |
| 6528352 | Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications | Raymond A. Jackson, Thomas E. Lombardi, Amy B. Ostrander | 2003-03-04 |
| 6509687 | Metal/dielectric laminate with electrodes and process thereof | Govindarajan Natarajan, Raschid J. Bezama, Robert W. Pasco | 2003-01-21 |
| 6494758 | Process of forming metal/ferrite laminated magnet | Govindarajan Natarajan, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 2002-12-17 |
| 6489686 | Multi-cavity substrate structure for discrete devices | Mukta S. Farooq, Srinivasa S. N. Reddy | 2002-12-03 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Jon A. Casey, Dinesh Gupta, Lester W. Herron, David C. Long, Jawahar P. Nayak +2 more | 2002-11-05 |
| 6461493 | Decoupling capacitor method and structure using metal based carrier | Mukta S. Farooq, Shaji Farooq, Robert A. Rita, Srinivasa N. Reddy | 2002-10-08 |
| 6413339 | Low temperature sintering of ferrite materials | Govindarajan Natarajan, Jon A. Casey, Martin Klepeis, Srinivasa S. N. Reddy, Robert A. Rita +1 more | 2002-07-02 |
| 6402866 | Powdered metallic sheet method for deposition of substrate conductors | Jon A. Casey, David C. Long, Brenda Peterson | 2002-06-11 |
| 6389940 | Gang punch tool assembly | David C. Long, Mark J. LaPlante, Thomas Weiss, Robert P. Westerfield, Jr. | 2002-05-21 |
| 6376983 | Etched and formed extractor grid | John Beeteson, Andrew Ramsay Knox, Anthony Cyril Lowe | 2002-04-23 |
| 6376054 | Surface metallization structure for multiple chip test and burn-in | Scott I. Langenthal, Thomas E. Lombardi, Richard F. Indyk, Srinivasa S. N. Reddy, Richard A. Shelleman +2 more | 2002-04-23 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, Sudipta K. Ray, Kathleen A. Stalter | 2002-03-26 |