Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388578 | Wafer scale testing and initialization of small die chips | Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian, Kuniaki Sueoka | 2019-08-20 |
| 10388566 | Solder fill into high aspect through holes | Toyohiro Aoki, Kuniaki Sueoka, Kazushige Toriyama | 2019-08-20 |
| 10325839 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2019-06-18 |
| 10317625 | Polymer waveguide (PWG) connector assembly having both cores and cladding partially exposed | Hidetoshi Numata | 2019-06-11 |
| 10302868 | Polymer waveguide connector assembly method using cores and cladding that are both partially exposed | Hidetoshi Numata | 2019-05-28 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2019-04-09 |
| 10170443 | Debonding chips from wafer | — | 2019-01-01 |
| 10141278 | Chip mounting structure | Keiji Matsumoto, Keishi Okamoto, Kazushige Toriyama | 2018-11-27 |
| 10133003 | Single-mode polymer waveguide connector assembly | Hidetoshi Numata | 2018-11-20 |
| 10107966 | Single-mode polymer waveguide connector assembly | Hidetoshi Numata | 2018-10-23 |
| 10074583 | Circuit module and manufacturing method thereof | Sayuri Hada, Kuniaki Sueoka | 2018-09-11 |
| 9893031 | Chip mounting structure | Keiji Matsumoto, Keishi Okamoto, Kazushige Toriyama | 2018-02-13 |
| 9887119 | Multi-chip package assembly | — | 2018-02-06 |
| 9721812 | Optical device with precoated underfill | Masao Tokunari | 2017-08-01 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2017-03-07 |
| 9568405 | Method, apparatus, and structure for determining interposer thickness | Sayuri Hada, Keiji Matsumoto | 2017-02-14 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka, Kazushige Toriyama | 2016-10-11 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka, Kazushige Toriyama | 2016-06-21 |
| 7548674 | Alignment method for circular multi-core optical fiber | Fumiaki Yamada, Yoichi Taira | 2009-06-16 |
| 7217026 | Illuminator, liquid crystal display comprising it and lamp socket | Akiko Nishikai | 2007-05-15 |
| 6765634 | Liquid crystal display device and display device | Masaru Suzuki, Takashi Fujita, Naoya Kushida | 2004-07-20 |
| 6241358 | Tandem lighting panel | Eizaburo Higuchi, Tsuyoshi Ishikawa | 2001-06-05 |
| 6217184 | Light source device with uniformity in color temperature of emission | Yasuhiro Koike | 2001-04-17 |