Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11974404 | Method of producing circuit boards | Takeshi Tamura, Masashi SAWADAISHI, Takashi Fujita | 2024-04-30 |
| 11081368 | Method of dicing wiring substrate, and packaging substrate | Koji Imayoshi | 2021-08-03 |
| 10679865 | Method of dicing wiring substrate, and packaging substrate | Koji Imayoshi | 2020-06-09 |
| 10204854 | Packaging substrate and method of fabricating the same | — | 2019-02-12 |
| 9163149 | Implant material | Akira Mochizuki, Keishi Okamoto, Tatsuyuki Nakatani | 2015-10-20 |
| 9138507 | Method for manufacturing an implant material | Hiroki Nikawa, Seichiyou Makihira, Yuichi Mine, Yoshinori Abe, Tatsuyuki Nakatani +1 more | 2015-09-22 |
| 8430591 | Ballpoint pen tip and ballpoint pen | Keishi Okamoto, Satoru Ando, Tatsuyuki Nakatani, Kunihiro Toyota, Kouichi Takayama +2 more | 2013-04-30 |