Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081368 | Method of dicing wiring substrate, and packaging substrate | Yuki Nitta | 2021-08-03 |
| 11006516 | Wiring board, semiconductor device, and method of manufacturing wiring board | — | 2021-05-11 |
| 10790209 | Wiring circuit substrate, semiconductor device, method of producing the wiring circuit substrate, and method of producing the semiconductor device | — | 2020-09-29 |
| 10679865 | Method of dicing wiring substrate, and packaging substrate | Yuki Nitta | 2020-06-09 |
| 10056322 | Interposers, semiconductor devices, method for manufacturing interposers, and method for manufacturing semiconductor devices | Syuji Kiuchi | 2018-08-21 |
| 6483562 | Electrode substrate and reflection type liquid crystal display device having low compatibility between resins | Kenzo Fukuyoshi, Satoshi Kitamura | 2002-11-19 |
| 6249082 | Electrode plate having transparent type or reflective type multi-layered conductive film and method for manufacturing the same | Kenzo Fukuyoshi, Yukihiro Kimura | 2001-06-19 |
| 5667853 | Multilayered conductive film, and transparent electrode substrate and liquid crystal device using the same | Kenzo Fukuyoshi, Yukihiro Kimura, Osamu Koga, Katsunori Horachi | 1997-09-16 |