Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266593 | Method of forming semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Chin-Yu Ku | 2025-04-01 |
| 11942398 | Semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Chin-Yu Ku | 2024-03-26 |
| 11901266 | Semiconductor device structure and method for forming the same | Ting-Li Yang, Wen-Hsiung Lu, Lung-Kai Mao, Mirng-Ji Lii | 2024-02-13 |
| 11769716 | Semiconductor device and methods of forming the same | Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu +1 more | 2023-09-26 |