Issued Patents All Time
Showing 101–125 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10720487 | Structure and formation method of semiconductor device with magnetic element | Chin-Yu Ku, Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu | 2020-07-21 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2020-06-30 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo | 2020-06-23 |
| 10692828 | Package structure with protrusion structure | Pei-Haw Tsao, Li-Huan Chu | 2020-06-23 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2020-05-12 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Mirng-Ji Lii | 2020-05-05 |
| 10629580 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2020-04-21 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai | 2020-01-28 |
| 10535593 | Package structure having a plurality of conductive balls with narrow width for ball waist | Pi-Lan Chang, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang, Chun-Ying Lin +1 more | 2020-01-14 |
| 10522526 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Kuo-Chio Liu | 2019-12-31 |
| 10522382 | Method of manufacturing a semiconductor device | Yung-Jean Lu, Ming-Fa Chen, Jao Sheng Huang | 2019-12-31 |
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo | 2019-12-24 |
| 10515938 | Package on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2019-12-24 |
| 10515919 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Tin-Hao Kuo | 2019-12-24 |
| 10510661 | Semiconductor devices and methods of forming the same | Hon-Lin Huang, Chin-Yu Ku, Kuan-Chih Huang, Wei-Li Huang | 2019-12-17 |
| 10510710 | Bump-on-trace interconnect | Chen-Hua Yu | 2019-12-17 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510727 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2019-12-17 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10504856 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2019-12-10 |
| 10483226 | Semiconductor device and method of forming the same | Chin-Yu Ku, Hon-Lin Huang, Chao-Yi Wang, Chien-Hung Kuo | 2019-11-19 |
| 10483225 | Packaging assembly and method of making the same | Chita Chuang, Yao-Chun Chunag, Tsung-Shu Lin, Chen-Cheng Kuo | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |