Issued Patents All Time
Showing 126–150 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388620 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2019-08-20 |
| 10388622 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2019-08-20 |
| 10361181 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2019-07-23 |
| 10354931 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2019-07-16 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chung-Shi Liu, Jiun Yi Wu | 2019-06-11 |
| 10319691 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2019-06-11 |
| 10290697 | Magnetic core inductor semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku | 2019-05-14 |
| 10290600 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2019-05-14 |
| 10288403 | Single sensor type three-dimensional micro/nano contact trigger measuring probe | Ruijun Li, Zhenying Cheng, Kuangchao Fan | 2019-05-14 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2019-05-07 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |
| 10276528 | Semicondcutor device and manufacturing method thereof | Chin-Yu Ku, Cheng-Lung Yang, Hon-Lin Huang, Chao-Yi Wang, Ching-Hui Chen +1 more | 2019-04-30 |
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2019-04-30 |
| 10276481 | Package structure having a plurality of conductive balls having narrow width for the ball waist | Pi-Lan Chang, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang, Chun-Ying Lin +1 more | 2019-04-30 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Tsung-Hsien Chiang, Ming Hung Tseng | 2019-04-23 |
| 10269759 | Trace design for bump-on-trace (BOT) assembly | Yen-Liang Lin, Tin-Hao Kuo | 2019-04-23 |
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Sheng-Pin Yang, Hon-Lin Huang, Chien-Chih Chou, Ting-Li Yang | 2019-04-23 |
| 10263064 | Semiconductor devices and methods of forming the same | Chin-Yu Ku, Chien-Chih Chou, Hon-Lin Huang, Chi-Cheng Chen, Kuang-Yi Wu | 2019-04-16 |
| 10209049 | Fabrication and monitoring device for micro probe ball tip | Ruijun Li, Zhenying Cheng, Kuangchao Fan | 2019-02-19 |
| 10163844 | Semiconductor device having conductive bumps of varying heights | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2018-12-25 |
| 10163873 | Package-on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2018-12-25 |
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo | 2018-12-25 |
| 10163756 | Isolation structure for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Wen-Chih Chiou, Chen-Hua Yu | 2018-12-25 |
| 10163781 | Semiconductor devices and methods of forming the same | Hon-Lin Huang, Chin-Yu Ku, Kuan-Chih Huang, Wei-Li Huang | 2018-12-25 |
| 10163827 | Package structure with protrusion structure | Pei-Haw Tsao, Li-Huan Chu | 2018-12-25 |