Issued Patents All Time
Showing 176–200 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chita Chuang, Chih-Hua Chen, Yao-Chun Chuang | 2018-01-30 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Yu-Chih Huang, Sheng-Yu Wu | 2018-01-16 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng | 2018-01-02 |
| 9837346 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Yu-Feng Chen | 2017-12-05 |
| 9837289 | Methods for forming package-on-package structures having buffer dams | Shou-Cheng Hu, Ching-Wen Hsiao | 2017-12-05 |
| 9824992 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2017-11-21 |
| 9812405 | Semiconductor package and manufacturing method of the same | Guan-Yu Chen, Yu-Wei Lin, Tin-Hao Kuo | 2017-11-07 |
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Yen-Chang Hu, Ching-Wen Hsiao | 2017-10-24 |
| 9786540 | Method of manufacturing a semiconductor device | Yung-Jean Lu, Ming-Fa Chen, Jao Sheng Huang | 2017-10-10 |
| 9786621 | Elongated bump structures in package structure | Chita Chuang, Ming Hung Tseng, Yao-Chun Chuang | 2017-10-10 |
| 9773755 | Substrate interconnections having different sizes | Wen-Wei Shen, Ying-Ching Shih, Ming-Fa Chen | 2017-09-26 |
| 9773749 | Warpage control of semiconductor die package | Kuo Lung Pan, Ching-Wen Hsiao | 2017-09-26 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2017-09-19 |
| 9761503 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2017-09-12 |
| 9748216 | Apparatus and method for a component package | Chih-Hua Chen, Ching-Wen Hsiao, Ming Hung Tseng | 2017-08-29 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chen-Cheng Kuo, Chita Chuang, Yao-Chun Chuang | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2017-08-22 |
| 9735130 | Chip packages and methods of manufacture thereof | Kuo Lung Pan, Ying-Jui Huang, Yu-Feng Chen | 2017-08-15 |
| 9711477 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2017-07-18 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chih-Hua Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9679862 | Semiconductor device having conductive bumps of varying heights | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2017-06-13 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Kai-Ming Ching, Bo-I Lee, Chien-Hsun Lee | 2017-06-06 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2017-06-06 |
| 9673125 | Interconnection structure | Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang, Yu-Jen Tseng | 2017-06-06 |