Issued Patents All Time
Showing 201–225 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666530 | Semiconductor device | Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9659918 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Dean Wang, Chung-Shi Liu, Jiun Yi Wu | 2017-05-23 |
| 9659903 | Method of manufacturing connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo | 2017-05-23 |
| 9646943 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2017-05-09 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Mirng-Ji Lii | 2017-05-09 |
| 9646894 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2017-05-09 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Wei Sen Chang, Yu-Feng Chen, Mirng-Ji Lii | 2017-05-02 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Yu-Feng Chen, Sheng-Yu Wu | 2017-04-25 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Han-Ping Pu | 2017-04-11 |
| 9613917 | Package-on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2017-04-04 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Yu-Feng Chen | 2017-03-28 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Jiun Yi Wu, Ru-Ying Huang | 2017-03-28 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Feng Chen | 2017-03-07 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-02-28 |
| 9576821 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen | 2017-02-21 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Yu-Feng Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-01-31 |
| 9543278 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2017-01-10 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Chen-Hua Yu, Mirng-Ji Lii, Yu-Jen Tseng | 2017-01-03 |
| 9520379 | Method of forming bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2016-12-13 |
| 9508674 | Warpage control of semiconductor die package | Kuo Lung Pan, Ching-Wen Hsiao | 2016-11-29 |
| 9508668 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo | 2016-11-29 |
| 9508637 | Protrusion bump pads for bond-on-trace processing | Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2016-11-29 |
| 9496233 | Interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2016-11-15 |
| 9490167 | Pop structures and methods of forming the same | Hsu-Hsien Chen, Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu | 2016-11-08 |
| 9484317 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2016-11-01 |