Issued Patents All Time
Showing 251–275 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287191 | Semiconductor device package and method | Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo | 2016-03-15 |
| 9269688 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Tin-Hao Kuo | 2016-02-23 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chung-Shi Liu, Jiun Yi Wu | 2016-02-16 |
| 9258922 | PoP structures including through-assembly via modules | Chih-Hua Chen, Ching-Wen Hsiao | 2016-02-09 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo | 2016-02-09 |
| 9257385 | Landing areas of bonding structures | Chih-Horng Chang, Tin-Hao Kuo | 2016-02-09 |
| 9257332 | Through-assembly via modules and methods for forming the same | Chih-Hua Chen, Ching-Wen Hsiao | 2016-02-09 |
| 9232632 | Methods and apparatuses for detecting registration offsets | Xinhong Su | 2016-01-05 |
| 9224688 | Metal routing architecture for integrated circuits | Chita Chuang, Yao-Chun Chuang, Chih-Hua Chen, Chen-Cheng Kuo | 2015-12-29 |
| 9219046 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2015-12-22 |
| 9219106 | Integrated inductor | Yen-Liang Lin, Mirng-Ji Lii, Ching-Wen Hsiao, Tsung-Ding Wang | 2015-12-22 |
| 9209149 | Bump-on-trace structures with high assembly yield | Chih-Fan Huang, Yi-Teh Chou, Ming-Da Cheng, Tin-Hao Kuo, Chung-Shi Liu | 2015-12-08 |
| 9196573 | Bump on pad (BOP) bonding structure | Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo | 2015-11-24 |
| 9190348 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2015-11-17 |
| 9165796 | Methods and apparatus for bump-on-trace chip packaging | Yen-Liang Lin, Chang-Chia Huang, Tin-Hao Kuo, Sheng-Yu Wu | 2015-10-20 |
| 9165887 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Yen-Chang Hu | 2015-10-20 |
| 9159695 | Elongated bump structures in package structure | Yao-Chun Chuang, Chita Chuang, Ming Hung Tseng | 2015-10-13 |
| 9153550 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Yu-Min Liang, Tin-Hao Kuo | 2015-10-06 |
| 9142533 | Substrate interconnections having different sizes | Wen-Wei Shen, Ying-Ching Shih, Ming-Fa Chen | 2015-09-22 |
| 9142500 | Apparatus for lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Ching-Wen Hsiao, Chen-Cheng Kuo | 2015-09-22 |
| 9129818 | Semiconductor device having conductive pads and a method of manufacturing the same | Chen-Cheng Kuo, Tzuan-Horng Liu | 2015-09-08 |
| 9123788 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang +1 more | 2015-09-01 |
| 9117825 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2015-08-25 |
| 9111817 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo | 2015-08-18 |
| 9105533 | Bump structure having a single side recess | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2015-08-11 |