Issued Patents All Time
Showing 276–300 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105530 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo | 2015-08-11 |
| 9093440 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo | 2015-07-28 |
| 9093332 | Elongated bump structure for semiconductor devices | Tin-Hao Kuo, Yu-Feng Chen, Chen-Hua Yu, Sheng-Yu Wu, Chita Chuang | 2015-07-28 |
| 9087832 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Yen-Chang Hu, Ching-Wen Hsiao | 2015-07-21 |
| 9070644 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2015-06-30 |
| 9064881 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Han-Ping Pu | 2015-06-23 |
| 9059107 | Packaging methods and packaged devices | Kuo Lung Pan, Ming Hung Tseng | 2015-06-16 |
| 9053989 | Elongated bump structure in semiconductor device | Chen-Cheng Kuo, Chita Chuang, Tsung-Shu Lin | 2015-06-09 |
| 9053990 | Bump interconnection techniques | Chita Chuang, Yao-Chun Chuang, Yu-Chen Hsu, Ming Hung Tseng | 2015-06-09 |
| 9040350 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Cheng Kuo, Chih-Hua Chen | 2015-05-26 |
| 9035461 | Packaged semiconductor devices and packaging methods | Yen-Chang Hu, Ching-Wen Hsiao | 2015-05-19 |
| 9006909 | Solder mask shape for BOT laminate packages | Chih-Horng Chang, Sheng-Yu Wu, Pei-Chun Tsai, Tin-Hao Kuo | 2015-04-14 |
| 8981576 | Structure and method for bump to landing trace ratio | Chen-Hua Yu, Tin-Hao Kuo, Mirng-Ji Lii, Sheng-Yu Wu, Yen-Liang Lin | 2015-03-17 |
| 8975726 | POP structures and methods of forming the same | Hsu-Hsien Chen, Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu | 2015-03-10 |
| 8932906 | Through silicon via bonding structure | Dean Wang, Kai-Ming Ching, Bo-I Lee, Chien-Hsiun Lee | 2015-01-13 |
| 8928114 | Through-assembly via modules and methods for forming the same | Chih-Hua Chen, Ching-Wen Hsiao | 2015-01-06 |
| 8922006 | Elongated bumps in integrated circuit devices | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Tsung-Shu Lin, Chang-Chia Huang | 2014-12-30 |
| 8922005 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Yen-Chang Hu, Ching-Wen Hsiao, Chih-Hua Chen, Tin-Hao Kuo | 2014-12-30 |
| 8921222 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Ching-Wen Hsiao | 2014-12-30 |
| 8916971 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2014-12-23 |
| 8912649 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2014-12-16 |
| 8901736 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2014-12-02 |
| 8889484 | Apparatus and method for a component package | Chih-Hua Chen, Ching-Wen Hsiao, Ming Hung Tseng | 2014-11-18 |
| 8883628 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Tsung-Shu Lin, Chen-Cheng Kuo | 2014-11-11 |
| 8871609 | Thin wafer handling structure and method | Chen-Hua Yu, Kuo-Ching Hsu, Ching-Wen Hsiao | 2014-10-28 |