Issued Patents All Time
Showing 326–350 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8624376 | Package-on-package structure without through assembly vias | Chih-Hua Chen | 2014-01-07 |
| 8624360 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming-Hong Tseng | 2014-01-07 |
| 8598691 | Semiconductor devices and methods of manufacturing and packaging thereof | Sheng-Yu Wu, Tin-Hao Kuo, Ming-Da Cheng | 2013-12-03 |
| 8598030 | Process for making conductive post with footing profile | Chen-Cheng Kuo | 2013-12-03 |
| 8546945 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Ching-Wen Hsiao | 2013-10-01 |
| 8546941 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2013-10-01 |
| 8513119 | Method of forming bump structure having tapered sidewalls for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Wen-Chih Chiou, Chen-Hua Yu | 2013-08-20 |
| 8476769 | Through-silicon vias and methods for forming the same | Chih-Hua Chen, Chen-Cheng Kuo, Kuo-Ching Hsu, Kai-Ming Ching | 2013-07-02 |
| 8476759 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Tsung-Shu Lin, Chen-Cheng Kuo | 2013-07-02 |
| 8461045 | Bond pad connection to redistribution lines having tapered profiles | Kuo-Ching Hsu, Hon-Lin Huang | 2013-06-11 |
| 8426256 | Method of forming stacked-die packages | C. W. Hsiao, Bo-I Lee, Tsung-Ding Wang, Kai-Ming Ching, Chien-Hsiun Lee +1 more | 2013-04-23 |
| 8334170 | Method for stacking devices | Dean Wang, Chien-Hsiun Lee, Clinton Chao, Mirng-Ji Lii, Tjandra Winata Karta | 2012-12-18 |
| 8318596 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Ching-Wen Hsiao | 2012-11-27 |
| 8299616 | T-shaped post for semiconductor devices | Yao-Chun Chuang, Chen-Cheng Kuo, Ching-Wen Hsiao | 2012-10-30 |
| 8288872 | Through silicon via layout | Ming-Fa Chen | 2012-10-16 |
| 8278152 | Bonding process for CMOS image sensor | Jen-Cheng Liu, Dun-Nian Yaung, Chen-Cheng Kuo, Shou-Gwo Wuu | 2012-10-02 |
| 8241963 | Recessed pillar structure | Wen-Wei Shen, Yao-Chun Chuang, Ming-Fa Chen | 2012-08-14 |
| 8232643 | Lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Ching-Wen Hsiao, Chen-Cheng Kuo | 2012-07-31 |
| 8227924 | Substrate stand-offs for semiconductor devices | Cheng Hung Shen, Tin-Hao Kuo, Chen-Cheng Kuo, Yao-Chun Chuang | 2012-07-24 |
| 8202800 | Method of forming through silicon via with dummy structure | Chih-Hua Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2012-06-19 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2012-06-05 |
| 8178970 | Strong interconnection post geometry | Wen-Wei Shen, Chen-Cheng Kuo, Chih-Hua Chen, Ching-Wen Hsiao | 2012-05-15 |
| 8158489 | Formation of TSV backside interconnects by modifying carrier wafers | Hon-Lin Huang, Ching-Wen Hsiao, Kuo-Ching Hsu | 2012-04-17 |
| 8158456 | Method of forming stacked dies | Ming-Fa Chen, Wen-Chih Chiu | 2012-04-17 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Ming-Hong Tseng, Kai-Ming Ching, Ching-Wen Hsiao, Hon-Lin Huang, Tsung-Ding Wang | 2012-01-17 |