Issued Patents All Time
Showing 301–325 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866285 | Fan-out package comprising bulk metal | Yen-Chang Hu, Chang-Chia Huang, Ching-Wen Hsiao | 2014-10-21 |
| 8859424 | Semiconductor wafer carrier and method of manufacturing | Yung-Jean Lu, Ming-Fa Chen, Jao Sheng Huang | 2014-10-14 |
| 8853853 | Bump structures | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2014-10-07 |
| 8847387 | Robust joint structure for flip-chip bonding | Ching-Wen Hsiao, Yao-Chun Chuang, Chen-Cheng Kuo, Ru-Ying Huang | 2014-09-30 |
| 8829673 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang +1 more | 2014-09-09 |
| 8823170 | Apparatus and method for three dimensional integrated circuits | Sheng-Yu Wu, Pei-Chun Tsai, Chih-Horng Chang, Tin-Hao Kuo | 2014-09-02 |
| 8816507 | Package-on-Package structures having buffer dams and method for forming the same | Yen-Chang Hu, Ching-Wen Hsiao | 2014-08-26 |
| 8803319 | Pillar structure having a non-planar surface for semiconductor devices | Tin-Hao Kuo, Ching-Wen Hsiao | 2014-08-12 |
| 8772950 | Methods and apparatus for flip chip substrate with guard rings outside of a die attach region | Chita Chuang, Yao-Chun Chuang, Chen-Cheng Kuo | 2014-07-08 |
| 8766441 | Methods and apparatus for solder on slot connections in package on package structures | Wei Sen Chang, Ching-Wen Hsiao | 2014-07-01 |
| 8765497 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Cheng Kuo, Chih-Hua Chen | 2014-07-01 |
| 8759949 | Wafer backside structures having copper pillars | Chen-Hua Yu, Hon-Lin Huang, Kuo-Ching Hsu | 2014-06-24 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2014-06-17 |
| 8736050 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Ching-Wen Hsiao, Kuo-Ching Hsu | 2014-05-27 |
| 8729700 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Cheng Kuo, Tzuan-Horng Liu | 2014-05-20 |
| 8729699 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo | 2014-05-20 |
| 8716131 | Through silicon via layout | Ming-Fa Chen | 2014-05-06 |
| 8716123 | Method of forming an integrated circuit device | Chen-Cheng Kuo | 2014-05-06 |
| 8664041 | Method for designing a package and substrate layout | Yu-Jen Tseng, Guan-Yu Chen, Sheng-Yu Wu, Chen-Hua Yu, Mirng-Ji Lii +1 more | 2014-03-04 |
| 8659170 | Semiconductor device having conductive pads and a method of manufacturing the same | Chen-Cheng Kuo, Tzuan-Horng Liu | 2014-02-25 |
| 8659123 | Metal pad structures in dies | Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo | 2014-02-25 |
| 8653626 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen | 2014-02-18 |
| 8653648 | Zigzag pattern for TSV copper adhesion | Chih-Hua Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2014-02-18 |
| 8643196 | Structure and method for bump to landing trace ratio | Chen-Hua Yu, Tin-Hao Kuo, Mirng-Ji Lii, Sheng-Yu Wu, Yen-Liang Lin | 2014-02-04 |
| 8623756 | Reflow system and method for conductive connections | Chita Chuang, Sheng-Yu Wu, Tin-Hao Kuo, Pei-Chun Tsai, Ming-Da Cheng | 2014-01-07 |