Issued Patents All Time
Showing 151–175 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157884 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Yen-Chang Hu | 2018-12-18 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Yu-Chih Huang, Sheng-Yu Wu | 2018-12-18 |
| 10157829 | Method for forming a passive device on a package-on-package structure | Chih-Hua Chen | 2018-12-18 |
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Mirng-Ji Lii | 2018-12-11 |
| 10141281 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2018-11-27 |
| 10134706 | Warpage control of semiconductor die package | Kuo Lung Pan, Ching-Wen Hsiao | 2018-11-20 |
| 10128195 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Yu-Min Liang, Tin-Hao Kuo | 2018-11-13 |
| 10115686 | Semiconductor structure and fabricating method thereof | Wei-Li Huang, Jheng-Jie Wong, Hsiang-Sheng Su, Tsung Lung Huang, Kuo-Chio Liu +3 more | 2018-10-30 |
| 10084032 | Semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku | 2018-09-25 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2018-08-21 |
| 10050000 | Bump-on-trace structures with high assembly yield | Chih-Fan Huang, Chung-Shi Liu, Ming-Da Cheng, Tin-Hao Kuo, Yi-Teh Chou | 2018-08-14 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Yu-Wei Lin, Guan-Yu Chen, Tin-Hao Kuo, Yen-Liang Lin | 2018-08-07 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Ming Hung Tseng +1 more | 2018-07-31 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2018-07-10 |
| 10008479 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2018-06-26 |
| 10008459 | Structures having a tapering curved profile and methods of making same | Pei-Chun Tsai, Yu-Jen Tseng, Tin-Hao Kuo | 2018-06-26 |
| 9991224 | Bump-on-trace interconnect having varying widths and methods of forming same | Chen-Hua Yu | 2018-06-05 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo | 2018-06-05 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-06-05 |
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo | 2018-05-08 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo | 2018-04-24 |
| 9935081 | Hybrid interconnect for chip stacking | Kuo Lung Pan, Yu-Feng Chen, Mirng-Ji Lii | 2018-04-03 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Yu-Feng Chen, Sheng-Yu Wu | 2018-04-03 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Mirng-Ji Lii | 2018-03-13 |
| 9911725 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2018-03-06 |