Issued Patents All Time
Showing 76–100 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094776 | Structure and formation method of semiconductor device with magnetic element covered by polymer material | Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang +2 more | 2021-08-17 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 11081459 | Semiconductor device | Chin-Yu Ku, Hon-Lin Huang, Chao-Yi Wang, Chien-Hung Kuo | 2021-08-03 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2021-06-22 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2021-06-01 |
| 11018086 | Passive devices in package-on-package structures and methods for forming the same | Chih-Hua Chen | 2021-05-25 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2021-04-20 |
| 10978433 | Package-on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2021-04-13 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2021-03-30 |
| 10879228 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2020-12-29 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10868106 | Semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku | 2020-12-15 |
| 10867810 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2020-12-08 |
| 10854577 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Shou-Cheng Hu | 2020-12-01 |
| 10847493 | Bump-on-trace interconnect | Chen-Hua Yu | 2020-11-24 |
| 10833033 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2020-11-10 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2020-10-20 |
| 10797005 | Semiconductor package and method for manufacturing the same | Ming-Da Cheng, Ming-Chih Yew, Yu-Tse Su | 2020-10-06 |
| 10784223 | Elongated bump structures in package structure | Yao-Chun Chuang, Chita Chuang, Ming Hung Tseng | 2020-09-22 |
| 10756162 | Structure and formation method of semiconductor device with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2020-08-25 |
| 10748810 | Method of manufacturing an integrated inductor with protections caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang +1 more | 2020-08-18 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng | 2020-08-18 |
| 10741477 | Semiconductor devices and methods of forming the same | Cheng-Lung Yang, Chih-Hung Su, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin | 2020-08-11 |
| 10734347 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2020-08-04 |