Issued Patents All Time
Showing 26–50 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng | 2024-05-07 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chih-Hua Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2024-04-16 |
| 11923353 | LTHC as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Kuo-Chio Liu | 2024-03-05 |
| 11908885 | Semiconductor device structure with magnetic element | Chin-Yu Ku, Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu | 2024-02-20 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2024-02-06 |
| 11894241 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu | 2024-02-06 |
| 11862588 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2024-01-02 |
| 11854835 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu | 2023-12-26 |
| 11855045 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2023-12-26 |
| 11855025 | Semiconductor device and package assembly including the same | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo | 2023-12-26 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Kuo-Ching Hsu, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-12 |
| 11824026 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2023-11-21 |
| 11784455 | Die layout calculation method, apparatus, medium, and device | Li-ming Hsiao | 2023-10-10 |
| 11764168 | Chip package structure with anchor structure and method for forming the same | Hui-Ting Lin, Chin-Fu Kao | 2023-09-19 |
| 11764118 | Structure and formation method of chip package with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li | 2023-09-19 |
| 11756849 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2023-09-12 |
| 11749711 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2023-09-05 |
| 11749575 | Semiconductor package structure having ring portion with recess for adhesive and method for forming the same | Hui-Ting Lin, Chin-Fu Kao | 2023-09-05 |
| 11742218 | Semiconductor device package having metal thermal interface material and method for forming the same | Chien-Li Kuo, Chin-Fu Kao | 2023-08-29 |
| 11742217 | Passive devices in package-on-package structures and methods for forming the same | Chih-Hua Chen | 2023-08-29 |
| 11728180 | Chip package structure with conductive adhesive layer | Kuo-Ching Hsu, Yu-Huan Chen | 2023-08-15 |
| 11682651 | Bump-on-trace interconnect | Chen-Hua Yu | 2023-06-20 |
| 11658143 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Tin-Hao Kuo | 2023-05-23 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2023-04-18 |