Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293951 | Semiconductor package structure having ring portion with recess for adhesive | Chin-Fu Kao, Chen-Shien Chen | 2025-05-06 |
| 12009337 | Bonding tool and bonding method thereof | Chih-Yuan Chiu, Shih-Yen Chen, Chi-Chun Peng, HONG-KUN CHEN | 2024-06-11 |
| 11764168 | Chip package structure with anchor structure and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-09-19 |
| 11749575 | Semiconductor package structure having ring portion with recess for adhesive and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-09-05 |
| 11424408 | ReRAM structure and method of fabricating the same | Shih-Min Chou, Kuo-Chih Lai, Wei-Ming Hsiao, Szu-Yao Yu, Nien-Ting Ho +2 more | 2022-08-23 |
| 11165019 | ReRAM structure and method of fabricating the same | Shih-Min Chou, Kuo-Chih Lai, Wei-Ming Hsiao, Szu-Yao Yu, Nien-Ting Ho +2 more | 2021-11-02 |
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Chun-Min LIN | 2021-10-19 |