Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362317 | Semiconductor die dipping structure | Chi-Chun Peng, Min Wu, Yi-Kai Tu, Cheng-Lung Wu | 2025-07-15 |
| 12009337 | Bonding tool and bonding method thereof | Shih-Yen Chen, Chi-Chun Peng, HONG-KUN CHEN, Hui-Ting Lin | 2024-06-11 |
| 10312118 | Bonding apparatus and method | Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang +3 more | 2019-06-04 |