Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6989606 | BGA substrate via structure | Joyce Hsu | 2006-01-24 |
| 6596620 | BGA substrate via structure | Joyce Hsu | 2003-07-22 |
| 6504238 | Leadframe with elevated small mount pads | Joyce Hsu, Joe Chiu | 2003-01-07 |
| 6441486 | BGA substrate via structure | Joyce Hsu | 2002-08-27 |
| 6265769 | Double-sided chip mount package | Jimmy Liang, Justin Taekwon KONG | 2001-07-24 |
| 6249963 | System and method for coupling conductive pellets to a component of an integrated circuit | Jack H. Chou, Joyce Hsu | 2001-06-26 |