Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making an IC device using a single-headed bonder

Method for making an IC device using a single-headed bonder

US Patent 5979743 · Granted Nov 9, 1999

Estimated economic value: $37,872,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Offset gravure printing process for improved mold compound and die attach adhesi2013
Structure and method for bond pads of copper-metallized integrated circuits2009
Copper-metallized integrated circuits having electroless thick copper bond pads2008
Metallization scheme including a low modulus structure2007
Wire bonded semiconductor device having low inductance and noise2007
Structure and method for bond pads of copper-metallized integrated circuits2007
Method to achieve continuous hydrogen saturation in sparingly used electroless n2005
Wire bonding process for copper-metallized integrated circuits2004
Nickel plating process having controlled hydrogen concentration2003
Method to achieve continuous hydrogen saturation in sparingly used electroless n2003
Wire bonded flip-chip assembly of semiconductor devices2001
System, apparatus, and method for connecting a semiconductor chip to a three-dim2000