Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wire bonded semiconductor device having low inductance and noise

Wire bonded semiconductor device having low inductance and noise

US Patent 7265443 · Granted Sep 4, 2007

Estimated economic value: $20,738,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Coaxial four-point probe for low resistance measurements2015
Offset gravure printing process for improved mold compound and die attach adhesi2013
Coaxial four-point probe for low resistance measurements2012
Structure and method of high performance two layer ball grid array substrate2010
Structure and method for bond pads of copper-metallized integrated circuits2009
Copper-metallized integrated circuits having electroless thick copper bond pads2008
Metallization scheme including a low modulus structure2007
Structure and method for bond pads of copper-metallized integrated circuits2007
Low capacitance coupling wire bonded semiconductor device2007
Semiconductor package with conductor impedance selected during assembly2006
FA tool using conductor model2006
Structure and method of high performance two layer ball grid array substrate2006