Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and method for bond pads of copper-metallized integrated circuits

Structure and method for bond pads of copper-metallized integrated circuits

US Patent 7535104 · Granted May 19, 2009

Estimated economic value: $15,118,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for electroplating a MEMS device2022
Method and system for electroplating a MEMS device2020
Selective planishing method for making a semiconductor device2019
Selective planishing method for making a semiconductor device2018
Semiconductor package having etched foil capacitor integrated into leadframe2016
Semiconductor package having etched foil capacitor integrated into leadframe2015
Semiconductor package having etched foil capacitor integrated into leadframe2015
Copper leadframe finish for copper wire bonding2015
Selective leadframe planishing2015
Semiconductor device with selective planished leadframe2015
Method of manufacture integrated circuit package2014
Leadframe having selective planishing2013