Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796792 | Micro-electro-mechanical system having movable element integrated into leadframe-based package | William R. Krenik | 2014-08-05 |
| 8722444 | Microelectromechanical system having movable element integrated into substrate-based package | William R. Krenik | 2014-05-13 |
| 8648430 | Microelectromechanical system having movable element integrated into substrate-based package | William R. Krenik | 2014-02-11 |
| 8338208 | Micro-electro-mechanical system having movable element integrated into leadframe-based package | William R. Krenik | 2012-12-25 |
| 8304274 | Micro-electro-mechanical system having movable element integrated into substrate-based package | William R. Krenik | 2012-11-06 |
| 7910471 | Bumpless wafer scale device and board assembly | Sreenivasan K. Koduri | 2011-03-22 |
| 7368328 | Semiconductor device having post-mold nickel/palladium/gold plated leads | Donald C. Abbott | 2008-05-06 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads | Donald C. Abbott | 2007-09-11 |
| 6914332 | Flip-chip without bumps and polymer for board assembly | Sreenivasan K. Koduri | 2005-07-05 |
| 6768210 | Bumpless wafer scale device and board assembly | Sreenivasan K. Koduri | 2004-07-27 |