Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828660 | Semiconductor device with double nickel-plated leadframe | — | 2004-12-07 |
| 6724070 | Fine pitch lead frame | Robert M. Fritzsche | 2004-04-20 |
| 6713852 | Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin | Douglas W. Romm | 2004-03-30 |
| 6706561 | Method for fabricating preplated nickel/palladium and tin leadframes | — | 2004-03-16 |
| 6683380 | Integrated circuit with bonding layer over active circuitry | Taylor R. Efland, Walter Bucksch, Marco Corsi, Chi-Cheong Shen, John P. Erdeljac +5 more | 2004-01-27 |
| 6583500 | Thin tin preplated semiconductor leadframes | Douglas W. Romm | 2003-06-24 |
| 6545342 | Pre-finished leadframe for semiconductor devices and method of fabrication | — | 2003-04-08 |
| 6545344 | Semiconductor leadframes plated with lead-free solder and minimum palladium | — | 2003-04-08 |
| 6429050 | Fine pitch lead frame and method | Robert M. Fritzsche | 2002-08-06 |
| 6376901 | Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication | — | 2002-04-23 |
| 6365974 | Flex circuit substrate for an integrated circuit package | Raymond A. Frechette, Robert Sabo, Steve Smith, Christopher M. Sullivan, David W. West | 2002-04-02 |
| 6337445 | Composite connection structure and method of manufacturing | Douglas W. Romm | 2002-01-08 |
| 6245448 | Lead frame with reduced corrosion | — | 2001-06-12 |
| 6194777 | Leadframes with selective palladium plating | Paul R. Moehle | 2001-02-27 |
| 6180999 | Lead-free and cyanide-free plating finish for semiconductor lead frames | — | 2001-01-30 |
| 6153518 | Method of making chip size package substrate | David W. West | 2000-11-28 |
| 6144100 | Integrated circuit with bonding layer over active circuitry | Chi-Cheong Shen, Walter Bucksch, Marco Corsi, Taylor R. Efland, John P. Erdeljac +4 more | 2000-11-07 |
| 6080494 | Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array | — | 2000-06-27 |
| 5989935 | Column grid array for semiconductor packaging and method | — | 1999-11-23 |
| 5935719 | Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes | — | 1999-08-10 |
| 5731041 | Method for producing silicon coating having high surface area | Mohendra S. Bawa | 1998-03-24 |
| 5710456 | Silver spot/palladium plate lead frame finish | Robert M. Fritzsche | 1998-01-20 |
| 5672915 | Ceramic coated plastic package | Raymond A. Frechette | 1997-09-30 |
| 5633528 | Lead frame structure for IC devices with strengthened encapsulation adhesion | Raymond A. Frechette | 1997-05-27 |
| 5561320 | Silver spot/palladium plate lead frame finish | Robert M. Fritzsche | 1996-10-01 |