| 7939378 |
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
Donald C. Abbott, Michael Mitchell, Paul R. Moehle |
2011-05-10 |
| 7245006 |
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
Donald C. Abbott, Michael Mitchell, Paul R. Moehle |
2007-07-17 |
| 7064008 |
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
Donald C. Abbott |
2006-06-20 |
| 6953986 |
Leadframes for high adhesion semiconductor devices and method of fabrication |
Donald C. Abbott, Michael Mitchell, Paul R. Moehle |
2005-10-11 |
| 6849806 |
Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor |
Donald C. Abbott |
2005-02-01 |
| 6713852 |
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
Donald C. Abbott |
2004-03-30 |
| 6583500 |
Thin tin preplated semiconductor leadframes |
Donald C. Abbott |
2003-06-24 |
| 6337445 |
Composite connection structure and method of manufacturing |
Donald C. Abbott |
2002-01-08 |
| 5444923 |
Quick cure exhaust manifold |
Larry W. Nye, Michael R. Head |
1995-08-29 |