Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10962571 | Interposers having cuts through an insulating substrate | Thiha Shwe, Hisashi Ata, John Allen Hite | 2021-03-30 |
| 8471577 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Daniel Stillman, William John Antheunisse, Norman J. Armendariz, Ramyanshu Datta, Margaret Simmons-Matthews +1 more | 2013-06-25 |
| 8344749 | Through carrier dual side loop-back testing of TSV die after die attach to substrate | Daniel Stillman, William John Antheunisse, Norman J. Armendariz, Ramyanshu Datta, Kenneth M. Butler +1 more | 2013-01-01 |
| 6943573 | System and method for site-to-site yield comparison while testing integrated circuit dies | — | 2005-09-13 |