Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8471577 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Daniel Stillman, James L. Oborny, Norman J. Armendariz, Ramyanshu Datta, Margaret Simmons-Matthews +1 more | 2013-06-25 |
| 8344749 | Through carrier dual side loop-back testing of TSV die after die attach to substrate | Daniel Stillman, James L. Oborny, Norman J. Armendariz, Ramyanshu Datta, Kenneth M. Butler +1 more | 2013-01-01 |
| 6289472 | Method and test system for testing under a plurality of test modes | Joseph W. Whitaker | 2001-09-11 |