Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6144102 | Semiconductor device package | — | 2000-11-07 |
| 6118183 | Semiconductor device, manufacturing method thereof, and insulating substrate for same | Norito Umehara | 2000-09-12 |
| 6007920 | Wafer dicing/bonding sheet and process for producing semiconductor device | Norito Umehara, Mamoru Kobayashi, Kazuyoshi Ebe | 1999-12-28 |
| 5986335 | Semiconductor device having a tapeless mounting | — | 1999-11-16 |
| 5960260 | Semiconductor device, its manufacturing method, and dicing adhesive element therefor | Norito Umehara | 1999-09-28 |
| 5882956 | Process for producing semiconductor device | Norito Umehara, Mamoru Kobayashi, Kazuyoshi Ebe | 1999-03-16 |
| 5466888 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Ichiro Anjoh, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-11-14 |
| 5406028 | Packaged semiconductor device having stress absorbing film | Lim T. Beng, Chai T. Chong, Ichiro Anjoh, Junichi Arita, Kunihiro Tsubosaki +2 more | 1995-04-11 |