Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8351215 | Method of manufacturing a chip embedded printed circuit board | Hong Won Kim, Sung Yi, Joon Seok Kang | 2013-01-08 |
| 8102043 | Stacked integrated circuit and package system and method for manufacturing thereof | Hyeog Chan Kwon, Youngcheol Kim | 2012-01-24 |
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Jae Han Chung, Taeg Ki Lim, Jong Wook Ju | 2011-11-29 |
| 8017437 | Method for manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-09-13 |
| 7875966 | Stacked integrated circuit and package system | Hyeog Chan Kwon, Youngcheol Kim | 2011-01-25 |
| 7875983 | Semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-01-25 |
| 7875497 | Method of manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-01-25 |
| 7642656 | Semiconductor package and method for manufacturing thereof | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Burn-Sik Jang | 2010-01-05 |
| 6060778 | Ball grid array package | Ki Tae Ryu, Tae Keun Lee, Keun Hyoung Choi, Han Shin Youn, Jum Sook Park | 2000-05-09 |
| 5095227 | MOS transistor temperature detecting circuit | — | 1992-03-10 |
| 4988897 | TTL to CMOS input buffer circuit | — | 1991-01-29 |