Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6160307 | Semiconductor packages having split die pad | — | 2000-12-12 |
| 5951804 | Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames | Kwang Soo Kim | 1999-09-14 |
| 5933708 | Lead-on-chip semiconductor package and method for making the same | Sung-Min Sim, Young-Hee Song, Hai-Jeong Sohn | 1999-08-03 |
| 5900676 | Semiconductor device package structure having column leads and a method for production thereof | Kyu Jin Lee, Wan Gyan Choi | 1999-05-04 |
| 5834832 | Packing structure of semiconductor packages | Jung Jin Kim, Young Jae Song, Young-Hee Song, Joung-Rhang Lee | 1998-11-10 |
| 5656856 | Reduced noise semiconductor package stack | — | 1997-08-12 |