Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8334602 | Die package including encapsulated die and method of manufacturing the same | Joon Seok Kang, Hong Won Kim, Jingli Yuan | 2012-12-18 |
| 8283768 | Wafer Level package for heat dissipation and method of manufacturing the same | Joon Seok Kang, Sung Yi | 2012-10-09 |
| 8273660 | Method of manufacturing a dual face package | Seung Wook Park, Jingli Yuan, Seon Hee Moon, Ju Pyo Hong, Jae Kwang Lee | 2012-09-25 |
| 8159071 | Semiconductor package with a metal post | Woon Chun Kim, Soon Gyu Yim, Jae Kwang Lee | 2012-04-17 |
| 8143099 | Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer | Seung Wook Park, Jin Gu Kim, Jong Hwan Baek, Jong Yun Lee, Hyung Jin Jeon | 2012-03-27 |
| 8138613 | Microelectronic devices | J. Michael Brooks, Tongbi Jiang | 2012-03-20 |
| 8119450 | Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots | Nazir Ahmad, Samuel Tam, Kyung-Moon Kim, Rajendra D. Pendse | 2012-02-21 |
| 8110914 | Wafer level package with removable chip protecting layer | Joon Seok Kang, Sung Yi | 2012-02-07 |
| 8093705 | Dual face package having resin insulating layer | Seung Wook Park, Jingli Yuan, Seon Hee Moon, Ju Pyo Hong, Jae Kwang Lee | 2012-01-10 |
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Sung Yi, Soon Gyu Yim, Seog Moon Choi, Jin Gu Kim | 2011-11-22 |
| 8026590 | Die package and method of manufacturing the same | Joon Seok Kang, Young-Ho Kim, Jin Gu Kim, Sung Yi | 2011-09-27 |
| 8017437 | Method for manufacturing a semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-09-13 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Hyung Jin Jeon, Seung Wook Park, Hee Kon Lee, Seon Hee Moon | 2011-05-24 |
| 7910385 | Method of fabricating microelectronic devices | J. Michael Brooks, Tongbi Jiang | 2011-03-22 |
| 7875497 | Method of manufacturing a semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |
| 7875983 | Semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |
| 7749882 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Tongbi Jiang | 2010-07-06 |
| 7727877 | Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar | Joon Seok Kang, Sung Yi, Jong Hwan Baek | 2010-06-01 |
| 7663250 | Wafer level package and manufacturing method thereof | Hyung Jin Jeon, Sung Yi, Jong Yun Lee, Jong Hwan Baek | 2010-02-16 |
| 7642656 | Semiconductor package and method for manufacturing thereof | Do Jae Yoo, Seog Moon Choi, Burn-Sik Jang, Tae Sung Jeong | 2010-01-05 |
| 7632709 | Method of manufacturing wafer level package | Hyung Jin Jeon, Sung Yi, Jong Yun Lee, Joon Seok Kang, Seung Wook Park | 2009-12-15 |
| 7407877 | Self-coplanarity bumping shape for flip-chip | Rajendra D. Pendse, Nazir Ahmad, Kyung-Moon Kim | 2008-08-05 |
| 7211901 | Self-coplanarity bumping shape for flip chip | Rajendra D. Pendse, Nazir Ahmad, Kyung-Moon Kim | 2007-05-01 |
| 6940178 | Self-coplanarity bumping shape for flip chip | Rajendra D. Pendse, Nazir Ahmad, Kyung-Moon Kim | 2005-09-06 |
| 6737295 | Chip scale package with flip chip interconnect | Rajendra D. Pendse, Nazir Ahmad, Andrea Chen, Kyung-Moon Kim, Samuel Tam | 2004-05-18 |