Issued Patents All Time
Showing 51–75 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781877 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Chia Yong Poo | 2010-08-24 |
| 7749882 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Young Do Kweon | 2010-07-06 |
| 7727785 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Michael Connell | 2010-06-01 |
| 7700406 | Methods of assembling integrated circuit packages | Setho Sing Fee, Lim Thiam Chye | 2010-04-20 |
| 7696011 | Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices | Shijian Luo | 2010-04-13 |
| 7659151 | Flip chip with interposer, and methods of making same | David J. Corisis | 2010-02-09 |
| 7655500 | Packaged microelectronic devices and methods for packaging microelectronic devices | J. Michael Brooks | 2010-02-02 |
| 7635611 | Semiconductor substrate for build-up packages | — | 2009-12-22 |
| 7633157 | Microelectronic devices having a curved surface and methods for manufacturing the same | Zhong-Yi Xia, Sandhya Sandireddy | 2009-12-15 |
| 7615871 | Method and apparatus for attaching microelectronic substrates and support members | — | 2009-11-10 |
| 7592691 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | David J. Corisis, Shijian Luo | 2009-09-22 |
| 7589426 | Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom | Li Li, William M. Hiatt | 2009-09-15 |
| 7578056 | Method of coating contacts on a surface of a flip chip | Farrah J. Johnson | 2009-08-25 |
| 7573136 | Semiconductor device assemblies and packages including multiple semiconductor device components | Setho Sing Fee, Tay Wuu Yean, Lim Thiam Chye | 2009-08-11 |
| 7557337 | Micro-lens configuration for small lens focusing in digital imaging devices | Michael Connell, Jin Li | 2009-07-07 |
| 7554200 | Semiconductor devices including porous insulators | Warren M. Farnworth | 2009-06-30 |
| 7550847 | Packaged microelectronic devices and methods for packaging microelectronic devices | J. Michael Brooks | 2009-06-23 |
| 7547579 | Underfill process | — | 2009-06-16 |
| 7537966 | Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer | Mike Connell | 2009-05-26 |
| 7485971 | Electronic device package | Jason L. Fuller, Frank Hall | 2009-02-03 |
| 7479413 | Method for fabricating semiconductor package with circuit side polymer layer | Mike Connell | 2009-01-20 |
| 7476277 | Apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2009-01-13 |
| 7442578 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices | Curtis Hollingshead, Warren M. Farnworth | 2008-10-28 |
| 7417305 | Electronic devices at the wafer level having front side and edge protection material and systems including the devices | Shijian Luo | 2008-08-26 |
| 7411297 | Microfeature devices and methods for manufacturing microfeature devices | Shijian Luo | 2008-08-12 |