Issued Patents All Time
Showing 76–100 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405385 | Micro-lens configuration for small lens focusing in digital imaging devices | Michael Connell, Jin Li | 2008-07-29 |
| 7358185 | Device having contact pad with a conductive layer and a conductive passivation layer | Li Li | 2008-04-15 |
| 7344061 | Multi-functional solder and articles made therewith, such as microelectronic components | Tsuyoshi Yamashita | 2008-03-18 |
| 7329949 | Packaged microelectronic devices and methods for packaging microelectronic devices | J. Michael Brooks | 2008-02-12 |
| 7312101 | Packaged microelectronic devices and methods for packaging microelectronic devices | J. Mike Brooks | 2007-12-25 |
| 7297412 | Fabrication of stacked microelectronic devices | Michael Connell | 2007-11-20 |
| 7298031 | Multiple substrate microelectronic devices and methods of manufacture | J. Michael Brooks | 2007-11-20 |
| 7285502 | Methods for forming porous insulator structures on semiconductor devices | Warren M. Farnworth | 2007-10-23 |
| 7268059 | Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components | W. Jeff Reeder | 2007-09-11 |
| 7268012 | Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby | Li Li, William M. Hiatt | 2007-09-11 |
| 7262487 | Semiconductor devices and other electronic components including porous insulators created from “void” creating materials | Warren M. Farnworth | 2007-08-28 |
| 7253089 | Microfeature devices and methods for manufacturing microfeature devices | Shijian Luo | 2007-08-07 |
| 7253025 | Multiple substrate microelectronic devices and methods of manufacture | J. Michael Brooks | 2007-08-07 |
| 7213331 | Method for forming stencil | Edward A. Schrock | 2007-05-08 |
| 7201304 | Multi-functional solder and articles made therewith, such as microelectronic components | Tsuyoshi Yamashita | 2007-04-10 |
| 7199464 | Semiconductor device structures including protective layers formed from healable materials | Shijian Luo, S. Hinkle | 2007-04-03 |
| 7199463 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2007-04-03 |
| 7199037 | Microfeature devices and methods for manufacturing microfeature devices | Shijian Luo | 2007-04-03 |
| 7198980 | Methods for assembling multiple semiconductor devices | Setho Sing Fee, Tay Wuu Yean, Lim Thiam Chye | 2007-04-03 |
| 7189602 | Method and apparatus for reducing substrate bias voltage drop | Zhiqiang Wu | 2007-03-13 |
| 7182241 | Multi-functional solder and articles made therewith, such as microelectronic components | Tsuyoshi Yamashita | 2007-02-27 |
| 7169685 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Michael Connell | 2007-01-30 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Mike Connell, Li Li, Curtis Hollingshead | 2007-01-30 |
| 7153754 | Methods for forming porous insulators from “void” creating materials and structures and semiconductor devices including same | Warren M. Farnworth | 2006-12-26 |
| 7153788 | Method and apparatus for attaching a workpiece to a workpiece support | Ed A. Schrock | 2006-12-26 |