Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7268059 | Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components | Tongbi Jiang | 2007-09-11 |
| 7071078 | Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials | Tongbi Jiang | 2006-07-04 |
| 6864153 | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another | Tongbi Jiang | 2005-03-08 |
| 6717259 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | Tongbi Jiang | 2004-04-06 |
| 6544864 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | Tongbi Jiang | 2003-04-08 |
| 6426552 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | Tongbi Jiang | 2002-07-30 |