Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11905733 | Dampener for an exit device | Vincent Baker, Michael Swearman, Douglas Thompson | 2024-02-20 |
| 11214996 | Retrofit latch adapter | Vincent Baker, Douglas Thompson, Catelyn Herman | 2022-01-04 |
| D936446 | Exit device | Luis Bettencourt, Doug Thompson | 2021-11-23 |
| D922173 | Door handle | Douglas Thompson, Luke E. Clay | 2021-06-15 |
| D906082 | Combined exit device and door | Luis Bettencourt, Doug Thompson | 2020-12-29 |
| 10704298 | Panic exit device and door handle | Doug Thompson, Luis Bettencourt | 2020-07-07 |
| 7727785 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Tongbi Jiang | 2010-06-01 |
| 7557337 | Micro-lens configuration for small lens focusing in digital imaging devices | Tongbi Jiang, Jin Li | 2009-07-07 |
| 7405385 | Micro-lens configuration for small lens focusing in digital imaging devices | Tongbi Jiang, Jin Li | 2008-07-29 |
| 7297412 | Fabrication of stacked microelectronic devices | Tongbi Jiang | 2007-11-20 |
| 7169685 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Tongbi Jiang | 2007-01-30 |
| 7115853 | Micro-lens configuration for small lens focusing in digital imaging devices | Tongbi Jiang, Jin Li | 2006-10-03 |
| 7037751 | Fabrication of stacked microelectronic devices | Tongbi Jiang | 2006-05-02 |
| 7037756 | Stacked microelectronic devices and methods of fabricating same | Tongbi Jiang | 2006-05-02 |
| 7022418 | Fabrication of stacked microelectronic devices | Tongbi Jiang | 2006-04-04 |
| 7001795 | Total internal reflection (TIR) CMOS imager | Tongbi Jiang, Jin Li | 2006-02-21 |
| 6995442 | Total internal reflection (TIR) CMOS imager | Tongbi Jiang, Jin Li | 2006-02-07 |
| 6896760 | Fabrication of stacked microelectronic devices | Tongbi Jiang | 2005-05-24 |
| 6894380 | Packaged stacked semiconductor die and method of preparing same | Tongbi Jiang | 2005-05-17 |
| 6882036 | Apparatuses for forming thin microelectronic dies | Nathan R. Draney | 2005-04-19 |
| 6762074 | Method and apparatus for forming thin microelectronic dies | Nathan R. Draney | 2004-07-13 |
| 6514795 | Packaged stacked semiconductor die and method of preparing same | Tongbi Jiang | 2003-02-04 |
| 6198861 | Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensors | Jon Kellar, William M. Cross, Jr., Farrah J. Johnson | 2001-03-06 |