Issued Patents All Time
Showing 26–50 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9503622 | Preventing artifacts due to underfill in flip chip imager assembly | Xiaofeng Fan | 2016-11-22 |
| 9446941 | Method of lower profile MEMS package with stress isolations | Jie Zhao, Peter Hartwell | 2016-09-20 |
| 9240385 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Young Do Kweon | 2016-01-19 |
| 9099571 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2015-08-04 |
| 8981578 | Sensor array package | Matthew E. Last, Lili Huang, Seung Jae Hong, Ralph Kauffman | 2015-03-17 |
| 8922002 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Young Do Kweon | 2014-12-30 |
| 8846424 | Multi-lens solid state lighting devices | Jin Li | 2014-09-30 |
| 8729590 | Solid state lighting devices having side reflectivity and associated methods of manufacture | Jaspreet S. Gandhi | 2014-05-20 |
| 8723307 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2014-05-13 |
| 8709866 | Methods of forming integrated circuit packages | Setho Sing Fee, Lim Thiam Chye | 2014-04-29 |
| 8680680 | Semiconductor devices including porous insulators | Warren M. Farnworth | 2014-03-25 |
| 8552438 | Multi-lens solid state lighting devices | Jin Li | 2013-10-08 |
| 8531031 | Integrated circuit packages | Setho Sing Fee, Lim Thiam Chye | 2013-09-10 |
| 8461685 | Substrate comprising a plurality of integrated circuitry die, and a substrate | Mike Connell | 2013-06-11 |
| 8436386 | Solid state lighting devices having side reflectivity and associated methods of manufacture | Jaspreet S. Gandhi | 2013-05-07 |
| 8178984 | Flip chip with interposer | David J. Corisis | 2012-05-15 |
| 8138613 | Microelectronic devices | Young Do Kweon, J. Michael Brooks | 2012-03-20 |
| 8092734 | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers | J. Mike Brooks | 2012-01-10 |
| 8072055 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | David J. Corisis, Shijian Luo | 2011-12-06 |
| 8022536 | Semiconductor substrate for build-up packages | — | 2011-09-20 |
| 7998860 | Method for fabricating semiconductor components using maskless back side alignment to conductive vias | Jin Li | 2011-08-16 |
| 7977157 | Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages | Setho Sing Fee, Lim Thiam Chye | 2011-07-12 |
| 7910385 | Method of fabricating microelectronic devices | Young Do Kweon, J. Michael Brooks | 2011-03-22 |
| 7888188 | Method of fabicating a microelectronic die having a curved surface | Zhong-Yi Xia, Sandhya Sandireddy | 2011-02-15 |
| 7851266 | Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers | Shijian Luo | 2010-12-14 |