Issued Patents All Time
Showing 101–125 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7150390 | Flip chip dip coating encapsulant | Farrah J. Johnson | 2006-12-19 |
| 7135780 | Semiconductor substrate for build-up packages | — | 2006-11-14 |
| 7122908 | Electronic device package | Yong Du | 2006-10-17 |
| 7115853 | Micro-lens configuration for small lens focusing in digital imaging devices | Michael Connell, Jin Li | 2006-10-03 |
| 7109588 | Method and apparatus for attaching microelectronic substrates and support members | — | 2006-09-19 |
| 7109063 | Semiconductor substrate for build-up packages | — | 2006-09-19 |
| 7105366 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2006-09-12 |
| 7094628 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices | Curtis Hollingshead, Warren M. Farnworth | 2006-08-22 |
| 7095095 | Semiconductor constructions | Zhiping Yin | 2006-08-22 |
| 7091065 | Method of making a center bond flip chip semiconductor carrier | Alan G. Wood | 2006-08-15 |
| 7091064 | Method and apparatus for attaching microelectronic substrates and support members | — | 2006-08-15 |
| 7087116 | Apparatus for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2006-08-08 |
| 7084515 | Electronic device package | Jason L. Fuller, Frank Hall | 2006-08-01 |
| 7078267 | Methods of fabricating integrated circuitry | Mike Connell | 2006-07-18 |
| 7074648 | Method for packaging flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2006-07-11 |
| 7071078 | Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials | W. Jeff Reeder | 2006-07-04 |
| 7071030 | Method of making a flexible substrate with a filler material | Edward A. Schrock | 2006-07-04 |
| 7061119 | Tape attachment chip-on-board assemblies | — | 2006-06-13 |
| 7037808 | Method of forming semiconductor constructions | Zhiping Yin | 2006-05-02 |
| 7037756 | Stacked microelectronic devices and methods of fabricating same | Michael Connell | 2006-05-02 |
| 7037751 | Fabrication of stacked microelectronic devices | Michael Connell | 2006-05-02 |
| 7022418 | Fabrication of stacked microelectronic devices | Michael Connell | 2006-04-04 |
| 7019410 | Die attach material for TBGA or flexible circuitry | — | 2006-03-28 |
| 7012811 | Method of tuning a multi-path circuit | John O. Jacobson, Alan G. Wood | 2006-03-14 |
| 7005878 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2006-02-28 |