Issued Patents All Time
Showing 151–175 of 313 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893952 | Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer | Salman Akram | 2005-05-17 |
| 6894380 | Packaged stacked semiconductor die and method of preparing same | Michael Connell | 2005-05-17 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2005-05-10 |
| 6891108 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2005-05-10 |
| 6889430 | Method of selectively adjusting surface tension of soldermask material | Partrick Tandy | 2005-05-10 |
| 6885108 | Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein | Shijian Luo, S. Hinkle | 2005-04-26 |
| 6881606 | Method for forming a protective layer for use in packaging a semiconductor die | Zhiping Yin, Mike Connell | 2005-04-19 |
| 6872600 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2005-03-29 |
| 6864153 | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another | W. Jeff Reeder | 2005-03-08 |
| 6858927 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2005-02-22 |
| 6844618 | Microelectronic package with reduced underfill and methods for forming such packages | Farrah J. Storli | 2005-01-18 |
| 6844052 | Method for underfilling semiconductor components | — | 2005-01-18 |
| 6841422 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2005-01-11 |
| 6833510 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2004-12-21 |
| 6825569 | BGA package having substrate with patterned solder mask defining open die attach area | Edward A. Schrock | 2004-11-30 |
| 6825570 | Resistance-reducing conductive adhesives for attachment of electronic components | Whonchee Lee | 2004-11-30 |
| 6820502 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2004-11-23 |
| 6818460 | Method for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2004-11-16 |
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Mike Connell, Li Li, Curtis Hollingshead | 2004-11-02 |
| 6803657 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2004-10-12 |
| 6791168 | Semiconductor package with circuit side polymer layer and wafer level fabrication method | Mike Connell | 2004-09-14 |
| 6788552 | Method and apparatus for reducing substrate bias voltage drop | Zhiqiang Wu | 2004-09-07 |
| 6787399 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2004-09-07 |
| 6784024 | Die attach curing method for semiconductor device | — | 2004-08-31 |
| 6779258 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2004-08-24 |